The penetration rate of third-generation semiconductors in various fields will continue to rise in 2022

According to TrendForce's latest report "2022 Third-Generation Semiconductor Power Application Market Report", although the demand for consumer electronics and other end markets has declined due to the repeated effects of the conflict between Russia and Ukraine and the epidemic, the third-generation semiconductors used in power components The penetration rate in various fields continues to rise, and the rapid development of 800V automotive electric drive systems, high-voltage fast charging piles, consumer electronics adapters, data centers and communication base station power supplies has pushed up 2022 SiC/GaN power semiconductors Market demand.

TrendForce focuses on the SiC/GaN power semiconductor market, discusses and analyzes the market size, opportunities and challenges, and supply chain based on end application requirements, so as to provide readers with a more comprehensive understanding of the third-generation semiconductor power electronics market.

SiC Power Semiconductors

Cost is the core factor limiting the large-scale application of SiC power components. The launch of Wolfspeed's world's first 8-inch SiC wafer fab undoubtedly sends a very important signal to the entire industry. Made a breakthrough in 8-inch substrates. It can be seen that the measures to expand the diameter and reduce the cost, which are highly expected by the market, have achieved initial results.

On the other hand, the industry is further reducing costs from the most primitive crystal growth and substrate processing, including TSSG crystal growth method, laser cutting technology, etc.

At present, the SiC power component market is mainly controlled by IDM manufacturers in Europe, America and Japan. The key suppliers STM, ON Semi, Wolfspeed, Infineon and ROHM have been deeply engaged in this field for a long time, and they have begun to compete fiercely in the key automotive market.

According to the survey and analysis of TrendForce, as more and more car companies begin to introduce SiC technology into electric drive systems, it is estimated that the market size of SiC power components for vehicles will reach US$1.07 billion in 2022, and will climb to 1.07 billion in 2026. $3.94 billion.

On the other hand, as the demand for SiC has entered an explosive period, Foundry has gradually emerged. In addition to the two mature manufacturers X-FAB and Hanlei, there have been exclusive foundries in mainland China such as Jetta Semiconductor, YOFC Advanced, Baishi Electronics & Kuanneng Semiconductor, and Xinyue Neng, and DB HiTek, a Korean silicon wafer foundry It is also determined to challenge the foundry of 8-inch SiC wafers to serve automotive MOSFETs.

GaN power semiconductors

GaN power components built on Si substrates have become the mainstream in the industry, but are still limited to medium and low voltage application scenarios. Therefore, the industry continues to try to use GaN-on-Sapphire, GaN-on-GaN and GaN-on-QST and other other structure to solve this problem.

GaN-on-Si power components have excellent cost advantages and have taken the lead in mass production in the consumer electronics market. Navitas and GaN Systems products entered Samsung's flagship mobile phone fast chargers this year, while Innosec creatively introduced GaN technology into The internal charging protection of mobile phones has also injected new vitality into the market.

Of course, manufacturers such as Transphorm have already turned their attention to industrial and automotive markets such as data centers and communication base stations. These fields contain huge penetration opportunities and are the key application directions of GaN power components in the future. Compared with SiC, the trend of vertical division of labor in the GaN industry is more obvious. Start-up Fabless is constantly flooding into the market, and foundries have ushered in huge development opportunities. With leading GaN-on-Si process capabilities and customer trust accumulated over the years, TSMC has mastered the vast majority of customer resources, and its production capacity has continued to be fully loaded. In order to meet the huge market demand in the future, major manufacturers have also begun to seek diversified foundry strategies, but from the current point of view, this is very difficult.

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